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Catalog : Chemicals : Heat Sink Compound

Silicone Heat Sink Compound, 1.7mL, Pouch

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Silicone Heat Sink Compound, 1.7mL, Pouch

SKU: 860-4G

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860 is a thermally conductive silicone paste. It is designed to reduce thermal resistance between irregular metal surfaces. It is most commonly used to improve heat flow between heat sinks and heat-generating components, such as CPUs, GPUs, LEDs, motors, and power components.

Features:

  • High thermal conductivity
  • High dielectric strength
  • Broad service temperature of -40 to 200 °C (-40 to 392 °F)
  • Excellent corrosion resistance
  • Non-bleeding
  • Non-electrically conductive
  • Long service life
Pricing

US$ 2.31 price
US$ 2.20 5 - 9 (5% Off)
US$ 2.08 10 + (10% Off)