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MG ADHESIVE - THERMAL CONDUCTIVE EPOXY, MEDIUM CURE (RATIO 1:1)
MG ADHESIVE - THERMAL CONDUCTIVE EPOXY, MEDIUM CURE (RATIO 1:1)
Product code : 8329TCM-50ML
82.86 $
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RP Electronics
Sherbrooke, QC
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Lévis, QC
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Description
Thermal adhesive, high TC. This heat sink adhesive paste is a 2 part 1-1 epoxy system. It is a smooth, dark gray paste that hardens to form a hard, durable, heat-conducting polymer. It provides strong electrical insulation and excellent protection against humidity, salt water, mild bases and aliphatic hydrocarbons.
Features
Additional information
Other features
Brand
MG CHEMICALS
Quantity
121g
Packing
2 jar kit
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