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MG ADHESIVE - THERMAL CONDUCTIVE EPOXY, SLOW CURE (RATIO 1:1)

MG ADHESIVE - THERMAL CONDUCTIVE EPOXY, SLOW CURE (RATIO 1:1)

Product code : 8329TCS-6ML

35.98 $

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RP Electronics
Sherbrooke, QC
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Lévis, QC
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Description

Thermal adhesive, high TC. This high thermal conductivity adhesive paste is a 2 part epoxy with a long working time of 4 hours. It is dark gray, smooth, viscous, thixotropic, and adheres well to a wide variety of substrates. Use this thermal adhesive paste to bond heat sinks to LEDs, CPUs, and other heat-generating components.

Features

Additional information

Other features

Brand
MG CHEMICALS
Quantity
14 g
Packing
Double syringe

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