Chemicals: Heat Sink Compound
  Thermally Conductive Epoxy Encapsulating & Potting Compound  
832TC-450ML Qty: 1 - 4
US $38.61 EA
Qty: 5 - 9
US $36.68 EA
Qty: 10 +
US $34.75 EA
100% solids. Formulated with undiluted Bis F resin for superior physical properties, and pigmented with high purity aluminum oxide pigment to provide excellent thermal conductivity at reasonable cost. Pigmented black for excellent thermal absorption and emission.

  • Provides superior protection from impact, shock, conductivity, moisture, abuse, chemicals, and analysis
  • Two part epoxy, with a 1 to 1 mixing ratio by volume
  • Two hour working time
  • Suitable for large production runs
  • Cures in 2 days at room temperature or one hour at 65 C
832TC-450ML : Thermally Conductive Epoxy Encapsulating & Potting Compound
Brand Logo     Approval Logo
   
 

Additional Information
Download MSDS (pdf)
Download MSDS (pdf)



RP Electronic Components Ltd.
All rights reserved. © 2008

www.rpelectronics.com
Friday, November 21, 2008
1:49:02 PM

Tel: (604) 738-6722
Specifications & prices subject 
to change without notice.